Thin plate grinding processing with warpage minimized to the extreme.
We have accumulated unique processing know-how for grinding and mirror finishing of thin plate products.
Introducing Daisen Industrial Co., Ltd.'s "Thin Plate Grinding Processing with Minimal Warpage." We apply grinding technology that processes thin plates with a thickness of 1.0mm to achieve warpage of 5μm or less, accumulating unique processing know-how for grinding and mirror finishing of thin plate products. Leveraging these processing technologies, we also apply them to enhance the precision of thin plate processing, special cutting tools, unit bases, and slide ways. 【Features】 ■ Application of grinding technology that processes thin plates with a thickness of 1.0mm to achieve warpage of 5μm or less ■ Accumulation of unique processing know-how for grinding and mirror finishing of thin plate products ■ Application to enhance the precision of thin plate processing, special cutting tools, unit bases, and slide ways *For more details, please refer to the PDF document or feel free to contact us.
- Company：大研工業
- Price：Other
